3D oblique CT
By scanning from an oblique angle, high-magnification
CT images of semiconductorPKGs & SMT boards can be obtained non-destructively.
In traditional vertical CT imaging, achieving higher magnification for non-destructive CT imaging of semiconductor packages (PKG) or SMT boards is challenging because the observation point cannot be positioned close to the focal spot of the X-ray tube. However, with 3D oblique CT,Test piece is placed as close as possible to the focal spot of the X-ray tube., and CT scanning is performed from an oblique angle to calculate the CT data.
This approach enables the acquisition of non-destructive, high-magnification CT images.