Drawing the future with one-of-a-kind X-ray technology


Case example video

Solder void horizontal cross section images under chip resistor by UHS 3D Oblique CT.

Cross-sectional slice image of VIA connections in interposer substrate taken by 3D oblique CT

Cross-sectional slice image of through-silicon via

3D Oblique CT scan  of 1005 size chip inductor

Analysis example of a PKG that caused a short circuit due to contamination between wire bondings

The case where a fingerprint sensor was non-destructively observed using a high-magnification 3D oblique CT.

Non-destructive observation of smartphone PCB board using UHS 3D X-ray oblique CT.